ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,035, issued on June 9, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Inhyung... Read More
ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,036, issued on June 9, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device and method" was ... Read More
ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,037, issued on June 9, was assigned to STMICROELECTRONICS S.r.l. (Agrate Brianza, Italy). "Method of manufacturing semiconductor devices and... Read More
ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,038, issued on June 9, was assigned to Renesas Electronics Corp. (Tokyo). "Semiconductor device" was invented by Katsuhiko Kitagawa (Tokyo),... Read More
ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,039, issued on June 9, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device and method of fo... Read More
ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,040, issued on June 9, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor device having wire protecting part" was inve... Read More
ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,041, issued on June 9, was assigned to MITSUBISHI ELECTRIC Corp. (Tokyo). "Power semiconductor apparatus and power conversion apparatus" was... Read More
ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,042, issued on June 9, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor module, semiconductor device, and vehicle" w... Read More
ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,043, issued on June 9, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package including heat dissipati... Read More
ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,044, issued on June 9, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package having metal line spaced... Read More